- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 24/62 - Sliding engagements with one side only, e.g. modular jack coupling devices
Patent holdings for IPC class H01R 24/62
Total number of patents in this class: 424
10-year publication summary
|
69
|
75
|
93
|
81
|
62
|
27
|
23
|
15
|
16
|
1
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Foxconn Interconnect Technology Limited | 1034 |
43 |
| Advanced Connectek Inc. | 338 |
22 |
| Japan Aviation Electronics Industry, Limited | 1585 |
13 |
| Molex, LLC | 1792 |
13 |
| Hon Hai Precision Industry Co., Ltd. | 4157 |
11 |
| TE Connectivity Solutions GmbH | 2580 |
11 |
| Apple Inc. | 50209 |
10 |
| Deako, Inc. | 21 |
9 |
| DVA Holdings LLC | 37 |
8 |
| DVA Mayday Corporation, DBA Deltavation | 31 |
7 |
| Leviton Manufacturing Co., Inc. | 844 |
7 |
| Samsung Electronics Co., Ltd. | 131630 |
6 |
| Amphenol Corporation | 748 |
6 |
| CommScope Technologies LLC | 4937 |
6 |
| Hewlett-Packard Development Company, L.P. | 28538 |
5 |
| Cypress Semiconductor Corporation | 1642 |
5 |
| CommScope, Inc. of North Carolina | 647 |
5 |
| Lotes Co., Ltd. | 346 |
5 |
| Masimo Corporation | 1234 |
5 |
| Cheng Uei Precision Industry Co., Ltd. | 636 |
4 |
| Other owners | 223 |